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Solder pot temperature In wave soldering with eutectic Sn-Pb, the solder pot temperature is typically in the range of 240 to 260 C. Surprisingly, the move to Pb-free soldering has not necessitated a big change in solder pot temperature. For SAC305 (Sn-3 percent Ag-0.5 percent Cu), solder pot temperature is typically maintained between 255 and 265 C. It is wise to use the lowest practical solder pot temperature to reduce solder oxidation (dross formation) and to limit dissolution of PWB or component materials. In many cases, major assembly houses are using the same solder pot temperature for Pb-free solder as was used for Pb-containing solder, and conveyor speed is slightly reduced for better preheating and to compensate for the lower wetting rate characteristic of most Pb-free solders. Oxidation Some of the Pb-free solder constituents such as copper, zinc, and bismuth are notorious for oxidizing. When using alloys in which such constituents are major components, nitrogen inerting is mandatory to ensure good soldering and to conserve solder composition by retarding oxidation and excessive dross formation. asp.net ean 128 EAN - 128 ASP . NET Control - EAN - 128 barcode generator with free ...
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Free download for .NET EAN 128 Barcode Generator trial package to create & generate EAN 128 barcodes in ASP . NET , WinForms applications using C#, VB. Flux Both alcohol-based and water-based (volatile organic compound [VOC]-free) fluxes are compatible with most Pb-free alloys. The longer preheat times and slightly higher wave temperature are more of a challenge for alcohol-based fluxes, as dry-out is a concern. Higher flux solids content will help in this regard. Water-based fluxes are the direction in which the industry is moving, and a higher boiling point is widely used for Pb-free soldering. Pb-free wave-solder joint appearance such as duller solder joints Just as in reflow soldering, wave-soldered joints tend to be duller than those obtained from eutectic Sn-Pb. This is not a defect but a reality. Fillet lifting This has been previously covered, but it is worth noting that the effect is more prevalent in Pb-free alloys than in Sn-Pb alloys. Fillet lifting occurs when the solder cools at a different rate than the board. The Sn-Bi system is notorious for resulting in lifted leads. Bi expands upon freezing and can rip itself off the bonding pad or rip the bonding pad from the laminate. Fillet lifting is generally controllable by optimization of the cooling ramp rate after soldering. asp.net ean 128 .NET GS1 - 128 / EAN - 128 Generator for C#, ASP . NET , VB.NET ...
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Barcode Rendering Framework Release.3.1.10729 components for Asp . Net , from http://barcoderender.codeplex.com/ The bar- code rendering framework quite ... When associated with the primary side of the board, fillet lifting is not considered a defect. If found on the secondary side (bottom) of the PWB, it is considered a workmanship defect with reliability consequences. Hot tears and shrink holes Most solders shrink upon solidification, and this is true of SAC solder.This alloy is known to form microcracks (see Fig. 47.30) on its surface during the phase change from liquid to solid. These cracks are called hot tears or shrink holes. They are generally benign as long as the crack is shallow (that is, the bottom of crack can be seen) and the crack neither extends to contact component lead nor PTH features (annular pad or barrel). FIGURE 47.30 Hot tear (shrink hole) on an SAC wavesoldered PTH joint. (Courtesy of Hewlett-Packard). asp.net ean 128 Where can I find a font to generate EAN 128 bar-codes? - Stack ...
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