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Fluxless Laser Soldering There have been many reports of fluxless laser soldering. As used for inner-lead bonding to silicon die, these utilize a high-peak-energy, short-duration pulse. Under these conditions, when the mass of the lead and the bonding pad is small enough, the process is more akin to welding with the component lead melting and alloying with an underlying metal such as tin. To accomplish conventional reflow soldering by means of a laser, or any other technique, it is necessary to employ a liquid solder flux or gaseous analogue pretreatment to bond effectively. Plasma cleaning and inert storage may be one such method. Ultrasonic assisted laser soldering can be effective, but is slow, requiring precise placement of an ultrasonically agitated head and running the laser beam either through the ultrasonic tool or precisely adjacent to it. The ultrasonic agitation breaks up the oxides surrounding the molten solder and the component lead, allowing joining of the liquid solder to the component lead metallurgy. The use of gaseous phase carboxylic acid fluxing with laser bonding has been demonstrated.15 This precludes the need for conventional liquid fluxes and leaves no visible residues on the circuit board. No cleaning is required and the assembly reliability is not degraded from the use of a gaseous fluxing approach.

The Panel Collection provides a number of useful features and facets that are commonly required for tables of data. The Panel Collection also automatically stretches its child component to fill the available space within the component.

Laser Solder-Joint Characteristics There are very few differences between solder joints prepared by laser as compared to those formed by other methods. Laser soldering results in intermetallic formation, but the layer is extremely thin if the laser soldering cycle heating is kept short much thinner than that found in solder joints manufactured by more conventional methods. Since the heating is highly localized, cooling is rapid resulting in exceptionally fine solder grain growth. The fine grain growth leads to greater joint strength initially. The strength advantage, although significant in magnitude, tapers off as the solder joint ages and metal grain coarsening occurs. Coarsening rate depends on ambient temperature and time.

Managing the LCD display Reading one or two potentiometers for input Making simple calculations and comparisons Reading information from various system components Setting high and low limits for the controllers Reading a keyboard Communicating with a computer Managing and annunciating alarms

Solder Sources and Defects Associated with Laser Reflow Solder requirements are the same as for any other process. There are no alloy composition requirements specific to laser soldering, as this soldering method is compatible with leaded or lead-free solder alloys. Even high-temperature alloys can be soldered by this technique. When single-point laser reflow is applied, the board quality and integrity are not compromised if parameters are chosen and adequately controlled. Laser soldering is not prone to solder bridges and if component leads are held down to soldercoated PWB lands, then soldering defects are rare. Perhaps the most common characteristic

defect unique to laser soldering is charring or burning of the circuit board, which occurs if too high an energy density is used and the laser damage threshold of the PWB is exceeded. Charring or burning of the PWB can also occur if the circuit board is grossly contaminated with grease or other organic contaminants. This is not to say that boards for laser soldering have extraordinary requirements for cleanliness. Requirements should be considered the same for this technique as for any other reflow process. 47.8.5 Laser Safety Issues Lasers are categorized by their safety hazard potential. A full review of these will not be provided, but suffice it to say that Class 1 is an intrinsically safe laser, posing no intra-ocular danger, while Class 4 lasers pose the greatest hazard. All lasers considered for soldering use are of the Class 4 variety. Because of this, they are generally embedded in appropriate interlocked cabinets with laser-safe viewing ports or a video camera incorporated to preclude direct ocular exposure to the laser s intense beam. When the Class 4 system is embedded in an interlocked cabinet, it is considered a Class 1 system and poses no hazard to the immediate area; laser-safe eyewear need not be worn except when interlocks are overridden for system maintenance. As mentioned previously, lasers, especially Nd:YAG, are known for their high uptime and lack of required expendables.

There are numerous excellent supplemental texts available for additional detail and instruction in laser technology. Those by S. Charschan,16 Hecht,17 and Ready18 are particularly useful. Additional information on CO2 lasers in the realm of soldering can be found in references.19, 20, 21, 22, 23, 24