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During the component removal step, solder surface tension capriciously allows some of the solder from the joint to be removed with the package leads and some to be left on the bonding pads In the case of area-array packages (BGA, ceramic ball grid array [CBGA], etc), the ball may remain with the package or with the land This can make solder land dressing a labor-intensive operation Care at this step is critical for success in resoldering a fresh component and for reliability The dressed bonding pads should be smooth so as not to interfere with fresh component placement 48225 Part Bake-Out As with first pass soldering, it is important to observe rules concerning component bake-out to remove any absorbed moisture and preclude part cracking during the reflow heating cycle Guidance for part baking can be found in IPC/JEDEC J-STD-0331 4822. pdf417 c# open source How to Create PDF417 Barcode in C# - E-iceblue
Jun 16, 2017 · The PDF417 barcode, also known as Portable Data File 417 or PDF417 Truncated, is a two-dimensional (2D), high-density symbology capable ... c# pdf417 open source Best 20 NuGet pdf417 Packages - NuGet Must Haves Package
Find out most popular NuGet pdf417 Packages. ... multi-format 1D/2D barcode image processing library originally implemented in Java. ... NET code in VB or C#. 6 Solder Paste or Flux Deposition Although this is not part of the hot-gas station, it is part of the hot-gas work cell and needs to be discussed For most SMT components, solder paste is added to either the board or the component to effect a reliable solder joint for component replacement This is generally done by ministencil similar to what is used for SMT solder paste deposition, but on a smaller scale; the stencil is only slightly larger than the component footprint The paste is pushed through the stencil apertures with a razor blade or a miniature stainless-steel squeegee Programmable syringe-dispenser machines are sometimes used, but solder paste is known to separate when under pressure, ie, solder alloy separates from the solder flux Choosing the largest needle bore, slowest dispense rates, and lowest pressures will help to mitigate paste separation. create pdf417 barcode in c# C#.NET PDF-417 Generator Control - Generate PDF417 Barcode in ...
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How to Generate 2D PDF-417 Barcode Images Using Visual C# in . ... PDF417, also named Portable Data File 417, PDF 417, PDF417 Truncated, is a stacked ... Also, use of direct drive auger pump rather than an air-pressure-driven dispenser will help to reduce paste separation Sometimes in BGA repair, solder paste is not used Instead, solder from the BGA ball is used to make the solder joint, and solder flux must be added for this bonding step The flaw in this methodology is that lowered solder volume results as compared to the original solder joint and the BGA reliability may not be as robust as when first soldered In fact, any repaired joint is less reliable than a first-pass solder joint due to thickening intermetallic layer formation that comes with each reflow cycle Addition of solder paste results in a better process because the paste compensates for small differences in BGA ball sizes It domes upon reflow, adding some compliance to make up for non-coplanarity solder balls. Opens are less likely to occur, although more process precision is required to dispense the paste and place the BGA. generate pdf417 c# Need PDF417 barcode generator source - CodeProject
I need PDF 417 barcode generator source code in C# or algorithm information document, can any one please help . We are not a free search ... c# create pdf417 Packages matching Tags:"PDF417" - NuGet Gallery
ZXing.Net is a port of ZXing, an open - source , multi-format 1D/2D barcode image processing library ... The PDF417 barcode encoder class library is written in C# . note Counter modules (sometimes referred to in this text as counters ) are an advanced subject not suitable for beginners. We are going to need to generate a pulse width modulated (PWM) signal for many of our experiments, so we need to talk about just this one application of a counter in a very cursory manner. Do not worry if you do not understand this in every detail just yet. without causing solder bridges Eliminating solder paste is not an option for area-array devices with noncollapsible interconnects, such as ceramic column grid arrays (CCGAs) or CBGAs Solder has to be added for rebonding of this type of component since the interconnects (balls or columns) are of a high-temperature solder alloy and will not reflow Most commonly, the necessary solder is added by the aforementioned ministencil method 48227 Soldering Preheat After flux deposition, the board is preheated to a temperature about 50 to 70 C below solder liquidus Generally, the hot-gas rework station has its own preheater and component and board preheating is part of the reflow profile 48228 Component Pickup As the board is preheating, the component is picked up and readied for placement. After the component is placed on a pickup station, the nozzle with vacuum pickup is placed and lowered over the component and the vacuum is activated The component is raised up and readied for the alignment step 48229 Component-to-PWB Alignment, Placement, and Reflow Generally, a split vision optics system is used and the semitransparent image of the component to be placed is superimposed over the video image of the PWB bonding pads for that component When the two are manually aligned, the component is lowered on to the solder paste- or flux-coated bonding pads and the thermal cycle begins Once reflowed and the solder reaches solidus, the rework process is complete The board is then ready for inspection 482210 Inspection Visual inspection should be conducted as practical to ensure integrity of any visible solder joints and also the area surrounding the rework. Ensure that solder mask is not charred or delaminated Also check whether bonding pads have delaminated (not possible on inner rows of area-array packages) For BGAs and other area-array devices, following a visual check, use transmission x-ray to inspect for solder bridges Sometimes this method also reveals lack of solder Lastly, if in-circuit testing or functional testing is done on the first-build product, then it should be applied to the reworked product also.. c# pdf417 generator PDF-417 C# Control - PDF-417 barcode generator with free C# ...
Free download for C# PDF 417Generator, generating PDF 417 in C# . ... PDF417, also named Portable Data File 417, PDF 417, PDF417 Truncated, is a stacked ... This barcode encoder control SDK library provides three methods to stream ... c# pdf417 Packages matching PDF417 - NuGet Gallery
The PDF417 barcode encoder class library is written in C# . ... The encoder library allows you to create a PDF417 barcode image from a text string or a binary ...
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