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9 Dec 2015 ... For generating Barcodes , we can use Barcode4j library , which is opensource and free library . Let's look at some java code to generate ... FIGURE 47.8 Schematic of a generic reflow profile for Sn-Ag-Cu solder paste. Time-temperature values are not precise and are shown for illustrative purposes for a discussion of reflow soldering. code 128 java encoder Code 128 Generator for Java , to generate & print linear Code 128 ...
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Alternatively, if you want to encode GS1-compatible QR Code, Data Matrix, GS1-​Databar, GS1-128/EAN-128 or ITF-14, please follow the basic Java class ... 47.3.5.1 Initial Ramp. In this step of the reflow time-temperature profile, preheating of the boards, components, and solder paste is initialized. The solder paste begins to lose some of its volatile components and the flux becomes chemically active (activates). If the ramp gradient is too steep, volatiles will be given up too rapidly, boiling will result, and the solder paste will spatter. This can cause explosive solder ball formation and decrease local solder volume, and thus impair bond reliability. Unattached solder balls may form solder bridges between two closely spaced conductors and produce an electrical short circuit. Overly rapid heating is known to cause component cracking. This is particularly true of ceramic components.To be safe, restrict the ramp rate to between 2 to 4 C/sec., but investigate component manufacturers specifications as well as the solder paste vendor s recommendation for the maximum allowable heating ramp. java code 128 Code 128 Generator for Java , to generate & print linear Code 128 ...
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Nevertheless, unlike Code 39, Code 128 is able to encode lowercase letters a through z. Besides, one digit of checksum should be included in the Code 128 . The checksum is calculated according to the data character and the start character based on modulo 103 calculation. 47352 Thermal Soak During this step, the solder, board, and components are further heated The flux from the solder paste flows onto all metal surfaces in which it is in contact, continues to react away surface oxides, and also acts as a barrier to prevent oxidation The soak is designed to provide the requisite time and thermal energy for the flux s prolonged chemical reaction with oxides and tarnishes on metal surfaces and the solder Were the flux to activate fully too early in the process, it could dry out or be spent too soon If its potency is lost, fluxed metal surfaces will reoxidize in the critical moments before the onset of solder liquidus, and solder wetting (alloying) would be inhibited 47353 Spike 473531 Onset of Solder Liquidus. In this step, the solder undergoes a phase change from solid to liquidThe liquid metal solder wets onto fluxed metallic surfaces and flows along the component lead-to-PWB pad interfaces drawn by surface tension, capillary forces, and convective flows within the liquid metal This is the essence of soldering and effective solderjoint formation Characterized by a rapid thermal rise, the spike s peak temperature is chosen to be well above the solder s melting point to ensure that all parts of the board, all components, and all solder paste deposits have surpassed solder liquidus onset As examples, for eutectic Sn-Pb solder, the peak temperature is generally 25 to 40 C above the melting point For Sn-Ag-Cu solders, the peak is a more conservative 15 to 30 C above the onset of liquidus. The lower temperature overage for SAC solder as compared to Sn-Pb is due to the higher melting range of the SAC alloy family and the potential damage to components and the circuit board due to the higher-temperature regime needed for reflow Also, since the temperature is higher than for SnPb, oxidation of heated metal surfaces is more likely, as is solder paste decomposition or charring 473532 Surface Tension Effects While the solder is molten, surface tension effects draw component leads into best registration with circuit board pads if the component is light enough to float upon the molten solder Passive devices (resistors, capacitors, inductors, etc), most components with formed leads, and plastic or laminate BGAs self-align during this step. Pos[3] stack2[25] stack3[25] stack4[25] stack5[25] Pulswidth PresPosition TargetPosition PositionError MinGain Gain MaxGain Index Integ PotOne Solder surface tension is typically not strong enough to effect self-alignment of heavy ceramic components such as ceramic ball grid arrays (CBGAs) and ceramic column grid array (CCGAs) 473533 Intermetallic Compound Formation As previously discussed, intermetallic compound (IMC) formation occurs when the molten solder wets to metal surfaces of component leads and PWB pads IMC thickness is dependent on the temperature and time at or above liquidus The longer the solder is heated, the thicker the intermetallic layer, and thick IMCs result in brittle bond lines and degraded solder-joint reliability For this reason, overheating the circuit board during the spike should be avoided Time-above-liquidus (TAL) should be in accordance with the solder-paste manufacturer s recommendation, which is typically 30 to 60 sec, although there are no hard and fast rules for TAL. java code 128 library Java Code 128 Generator | Barcode Code128 Generation in Java ...
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