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Sampling Inspection For some attributes, 100 percent inspection is not necessary or prudent. In these cases, a sampling of the PCBs from the inspection lot is allowed to represent the entire inspection lot. Most performance documents specify which attributes can use sampling inspection and to what extent sampling may be performed. There are many sampling plans available; the most widely known, and historically used, is MIL-STD-105, which describes an Acceptable Quality Level (AQL) for samples of an inspection lot. However, it allows a small amount of defective material to be considered acceptable and has typically been replaced by sample plans where defective parts that are found during inspection cause the lot to be termed nonconforming. This style of plan is defined as Defective Parts (C) Equals Zero (C = 0). If the inspection lot is

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considered nonconforming during a sampling procedure, the supplier may elect to screen 100 percent for the nonconformance, removing only the nonconforming PCBs from the inspection lot. 51.4.2 Inspection Tool Calibration It is important that the all inspections be carried out with equipment that is calibrated and traceable to internationally recognized standards. Two of the documents that govern inspection equipment and facilities are ISO-17025 and IPC-QL-651.

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R2 is the same value as X. Thus, the outcome of a sequence of two XORs using the same value produces the original value. To see this feature of the XOR in ...

51.5.1 Materials Inspection This inspection usually consists of certifications from the material supplier, supported by data from the supplier s own inspections. The materials used must be inspected by the PCB manufacturer to ensure compliance with customer requirements. 51.5.2 Qualification Inspection The PCB supplier must provide proof to the user of its qualifications to build the product specified. The user must then review this proof in order to minimize the risk associated with buying from the PCB manufacturer. This process usually includes the PCB manufacturer supplying a self-declaration of capabilities such as those found in the IPC-1710, and then supplying some kind of physical sample or testing data to support the assertions made in the self-declaration. It is up to the PCB user to determine the level and detail of qualification required. 51.5.3 Quality Conformance Inspection These product verification inspections use specified acceptability criteria and are performed prior to shipment of the PCBs to the customers. These inspections can be defined either by industry or customer standards, or a combination of both. 51.5.4 Reliability Testing This testing consists of looking for imperfections in the PCB that may show up some time during the product s field life. They include accelerated life testing for both the interconnection and insulation attributes of the PCB. Please see Chaps. 57, 58, and 59 for a detailed discussion of reliability testing.

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51.6 ACCEPTABILITY AND QUALITY AFTER SIMULATED SOLDER CYCLE(S)

Validation For a business service, you probably want to validate the data to ensure that it meets specific business and data requirements. For example, you need to enforce business rules such as not allowing a customer record to be created without first specifying the customer name, or not allowing a customer s credit limit to be more than $4000.

PRI repeat 'power PWM routine. phsa:=PulseWidth 'Send a high pulse for PulseWidth counts period:=period + Cycle_time 'Calculate cycle time waitcnt(period) 'Wait for the cycle time

The user expects the PCB to survive the assembly and rework process. Temperature excursions that approach or exceed the base material s glass transition temperature (Tg) can significantly affect some attributes of the PCB. For these attributes, it is important that the PCB be examined after solder cycling that simulates the type and quantity of soldering operations (rework included) that the PCB is expected to undergo during the assembly process. It is

FIGURE 51.2 Damage done to PCBs during typical leaded and lead-free solder cycles. (Courtesy of Microtek Laboratories.)

important to note that each rework process usually includes two soldering cycles: one to desolder the affected part, and one to reattach a new part.

51.6.1 The Effects of Lead-Free Assembly on PCB Acceptability and Quality The soldering process has a significant and detrimental effect on the PCB s reliability and quality. The lead-free assembly process increases both the soldering temperature and the time the PCB is exposed to that temperature. This will accelerate degradation of the base material and can have significant impact on the PCB. Figure 51.2 shows damage related to time and temperature above Tg. It is essential to establish that the PCB was capable of being assembled and was acceptable when it was delivered to the assembly organization, as poor assembly

techniques can severely compromise the integrity of the PCB. It is almost impossible to look at a PCB after assembly and definitively state that the fault lies entirely with the PCB manufacturer or with the assembly organization. 51.6.2 PCB Issues Created by Lead-Free Assembly

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The following requirements must be satisfied before proceeding to the tutorial on Creating barcodes in a RDLC report.. ConnectCode .Net Barcode SDK is ...
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