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This is the cog s own personal RAM This is where the Spin Interpreter is copied to from main RAM (or where Propeller Assembly code is copied to and executed) and for immediate use within the cog for internal calculations and dedicated special-purpose registers and general programming requirements Only the cog this RAM is in can access this RAM, meaning that the cogs are insulated from each other The only exception is the ability of one cog to pause or shut down another cog and to specify the program that the new cog is to run All the cogs share an external 32KB of hub RAM, which is addressable as bytes, words, or longs.

FIGURE 47.13 Thermocouple embedded into BGA ball. Leads are anchored to the board with a high-temperature adhesive or high-temperature tape.

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the board to keep them in place and to prevent dislodging of the bead from its intended measurement target (see Fig. 47.13). Note that there is no need to seal the drilled hole into which thermocouple is inserted. It is a miniature blind hole largely filled with thermocouple wires.Air transfer within this hole will be negligible. 47.3.10.3.3 Thermocouple Size. Many factors can confound the solder-joint temperature measurement process, regardless of whether the thermocouple bead is properly deployed between lead and pad. Among these are the size of the bead and the thermal mass of the thermocouple assembly. In general, the use of finer-gauge thermocouples such as 30 to 36 American Wire Gauge (AWG) (see Table 47.1) is recommended. This will permit insertion between lead and pad even at very fine lead and pad pitches. Ideally the thermocouple bead will be completely within the solder joint to be measured.

TABLE 47.1 AWG versus Wire Diameter and Anticipated Thermocouple Bead Diameter Wire diameter (in.) 0.032 0.020 0.010 0.005 Wire diameter (mm) 0.81 0.51 0.25 0.127 Bead diameter (in.) 0.048 0.030 0.015 0.0075 Bead diameter (mm) 1.22 0.76 0.38 0.19

Strive for the shortest possible length of thermocouple wire pair that is practical for the application. Long, large diameter wire may conduct heat away from the solder joint to be measured, altering its true heating nature. 47.3.10.3.4 Securing Thermocouples: Thermally Conductive Adhesives. If an adhesive is to be used to hold a thermocouple bead, its thermal conductivity must be taken into account. Most thermally conductive adhesives are not nearly as conductive as metal or solder. The best are filled with high thermal conductivity materials such as aluminum, boron nitride, or other

thermally conductive ceramics If the thermal conductivity is not high enough, a false thermocouple reading will result Thermally conductive adhesives are meant to be applied thinly and conductivity depends on bond-line thickness It is wise to baseline a conductive adhesive against a soldered thermocouple to ensure that it is not insulating and affecting measurement results Also ensure that it survives multiple reflow cycles and still maintains it thermal conductivity Were the adhesive to release the thermocouple bead during the process, then measurement data would be useless Many adhesives will not tolerate the high-temperature environment of soldering or the continuous thermal cycling encountered in trying to adjust a soldering profile This is especially true with the onset of Pb-free soldering and the higher soldering temperatures associated with the move away from lead-bearing alloys High-conductivity adhesives are also expensive 4731035 Securing Thermocouples: Adhesive Tapes.

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