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Stencil designs that preclude solder paste from entering the PTH also result in a significant reduction of solder paste on the top surface and in the PTH. These reductions may make the pin-in-paste technique impractical for some boards. If the solder volume is too low, the available solder distributes unevenly around the PTH pin and the PTH barrel, resulting in voids and inferior solder joints (see Fig. 47.18a, b). A normal incident x-ray will highlight circumferential voids in PTHs, as evidenced in Fig. 47.19. 47.3.11.3 Pin-in-Paste on Thick Boards. Since the solder volume increases proportionately with increasing board thickness, pin-in-paste soldering is best suited for thin PWBs ( 1.6 mm). The technique is limited by available solder and required solder volume for proper barrel fill. There are two ways to deal with the added volume. ean 128 word 2007 EAN - 128 Barcode Generator for Word - How to Generate EAN - 128 ...
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Is there any way to encode GS1 barcode like GS1 - 128 barcode in Word . If it is possible, do I need to install barcode font ? If not, what should I ... 473114 Addition of Solder through Pre-Forms Solder foil pre-forms (stamped solder foil) can be added to through-hole parts to augment solder volume (see Fig 4720) This approach is expensive and application of the pre-forms is tedious and time-consuming 473115 Buried Intrusive Method There is a new method for formation of a somewhat nonstandard solder joint in thick PWBs2 A foreshortened pin, on the order of that used for a board 16 mm in thickness, is used in the thick board So, too, solder volume is treated as if for a board 16 mm thick When the solder melts, it coalesces and wets to the pin and barrel as in any through-hole soldering process Conventional thinking would have the molten solder running through the barrel and out the bottom side of the board. Instead, nearly all the solder is retained by surface tension forces around pin and barrel If the solder volume is calculated properly and aptly delivered, there is 100 percent pin wetting both longitudinally and circumferentially (see Fig 4721) Accelerated thermal cycling followed by tensile testing has shown that resultant solder-joint reliability is sufficient and equivalent to conventionally formed pinin-paste or wave-soldered joints of twice the pin-wetted length 473116 Temperature Compatibility If pin-in-paste soldering is to be used, check that components are temperature-compatible with the oven reflow process The high temperatures and long exposures associated with oven reflow soldering may cause unsuited molded component bodies to melt or warp Connector contact normal force may be affected if the molded connector body softens or distorts. 4: Solder joints or wire bonds internal to some devices may become disbanded, and some, such as electrolytic capacitors, may leak or even explode as a result of an oven reflow cycle Check the component manufacturer s specification for thermal limits and compatibility with oven reflow soldering.. FIGURE 47.21 Cross-sectional micrograph showing pin-in-paste buried intrusive soldering. Note that very little solder has drained. Once the predominant method for mass assembly of circuit boards, wave soldering has taken a back seat to oven-based reflow soldering. The ease of surface mounting led to a rapid rise in popularity of oven-based technology, and proliferation of surface-mountable packages has led to a decreased reliance on wave soldering. Nonetheless, through-hole componentry persists and mixed-mount (surface-mount plus through-hole) technology still may be the only alternative for some assemblies, and it is unlikely that wave soldering will disappear from PWB manufacturing in the short term. Since wave soldering, compared to reflow soldering, is fraught with defects, it behooves the designer and assembler to minimize the number of PTH components on a board. Once you understand the basic information in Figure 5-2, take a look at Figure 5-3, which shows an expanded version of how a new cog is launched and how the various variables play out. For more examples of the opening of cogs, see the program listing in Parts II and III of this book. The programs tend to get progressively more difficult, so it is important to start with the shorter, simpler programs if you are having difficulty understanding the code. It is important to understand exactly what each line of code does before you move on to the more complicated code. Wave-Solder Process Basics Wave soldering utilizes a reservoir of molten solder pumped and circulated to form a standing wave. The circuit board is prepared with devices for wave soldering in one of three ways: ean 128 word font Utilisez Microsoft Word comme un Générateur de codes à Barres ...
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